Semiconductors

ANSYS offers a suite of semiconductor analysis tools that allows IC designers to get the design right the first time. The ANSYS semiconductor software solutions are used by more than 90% of the global semiconductor companies, including all of the top 20. This software allows designers to respond to the increasing demand for smart electronic devices and further miniaturization of integrated circuit (IC) technology.

The ANSYS electromagnetic software can simulate interacting physics that arise from shrinking geometries, stacked-die, and emerging 3D-IC architectures to predict power integrity and reliability performance. ANSYS simulation and modeling tools offer you early power budgeting analysis for high-impact design decisions and foundry-certified accuracy needed for IC sign-off.

Please contact us at anytime if you would like assistance in determining the right product for you! Below is some additional information about each of the products and the software capabilities.

ANSYS 19.2 Capabilities Chart

Capabilities

SDC Power Integrity ANSYS RedHawk provides the world’s leading simulation solution for system-on-chip (SoC) power integrity analysis. ANSYS simulation tools enable you to model supply voltage variations with sign-off accuracy and reduce the overall power noise impact through the package and board.
IR Power and Reliability Semiconductor intellectual property cores (IPs) are critical parts of any system-on-chip (SoC) design. ANSYS Totem offers a comprehensive co-simulation framework for analog, mixed-signal and custom circuit designs. Totem also provides a comprehensive full-chip solution for modeling and simulating noise injection, propagation and coupling through the on-die power grid RLC, substrate RC, and package RLC networks.
3-D and 2.5D IC Analysis Vertically-stacked integrated circuits (3D-IC) have emerged as a leading solution for getting higher performance in a smaller form factor with lower power requirements. The ANSYS RedHawk 3D-IC platform enables you to simulate multiple stacked ICs that use 2.5-D and 3-D integration, and to extract accurate package models during power and signal integrity simulations. RedHawk is the de facto standard for IC power integrity and reliability.
RTL Power Efficiency For Internet of Things and mobile technologies, which typically operate on batteries, ICs used that consistently require greater computing power in smaller chips, power consumption analysis of integrated circuits (ICs) is key to a successful design. ANSYS PowerArtist is a comprehensive register-transfer level (RTL) design-for-power platform enabling you to analyze, debug and improve power efficiency for digital ICs.
SOC Reliability Large system on chips (SoCs) using advanced FinFET technologies achieve higher performance and density in a smaller area. More chips in a smaller package, however, generate greater amounts of heat. ANSYS simulation and modeling tools give you the simulation and analysis accuracy you need to ensure top performance in even the most complex integrated systems.
Chip Package System Co-Design ANSYS solutions gives you the most comprehensive simulation platform in the industry for modeling chip thermal, power and signal integrity, as well as package modeling and system-level thermal modeling for chip-aware systems. Tools such as ANSYS RedHawk and ANSYS IcePak ensure optimal performance for your integrated circuit or SoC design.
Substrate Noise High speed digital cores, analog circuits, radio frequency modules and I/O interfaces integrated on the same IC, noise propagation can reduce circuit efficiency and affect circuit operations. The ANSYS Canyon Substrate Extension platform models noise propagation from the core and substrate, enabling you to minimize noise and optimize your design before prototyping.
Automotive IC Automotive designs increasingly incorporate multitudes of electronics systems to provide safety, comfort, and better performance. As more of these systems are integrated and operate simultaneously, poor system design can increase temperature, electrical noise, and create magnetic interference. The ANSYS software platform ensures these systems are validated for system integrity.
7NM Chip Design Next-generation automotive, mobile and high-performance computing applications demand the use of 7nm SoCs to deliver greater functionality and higher performance at much lower power. According to Gartner, when compared to 16nm/14nm technology, 7nm offers 35% speed improvement, 65% less power, and 3.3X density improvement. Hence, despite a whopping cost of $271M — per Gartner’s estimate — to design a 7nm chip, SoC design houses that can leverage economies of scale are continuing to adopt this technology to remain competitive. With aggressive time-to-market requirements, all that investment is wasted if the silicon fails, or even if it is late to market. Simply put, the cost of design failure is huge. Learn how ANSYS semiconductor solutions can help you achieve first time silicon success for your 7nm designs.

ANSYS Semiconductor Products

PathFinder

ANSYS PathFinder simulates electrostatic discharge (ESD) in full-chip SoC and IP designs for planning, verification and sign-off.

SeaHawk

ANSYS SeaHawk leverages Big Data through the ANSYS SeaScape architecture, enabling designers of advanced SoCs to assure the EM/IR integrity of their design before sign-off.

PowerArtist

ANSYS PowerArtist provides early RTL power estimation and analysis-driven power reduction for RTL-to-GDS design for power methodology.

RedHawk

As the de facto standard power integrity and reliability solution, ANSYS RedHawk accurately predicts chip power and noise using voltage drop simulation analysis for the entire power delivery network (PDN), from chip to package to board.

Totum

ANSYS Totem is a transistor-level power noise and reliability simulation platform for analog, mixed-signal and custom digital designs.