|
ansys
training
Multiphysics Simulation for MEMS
Duration: 3 Days
Cost: $1500
Course Topics Include:
- Geometric Nonlinearities and Initial Stress Contact
Analysis for MEMS Applications Pre-Stressed Modal
Analysis Beam Cross-Section Modeling
- Introduction to Electrostatic Analysis Capacitance
- Hybrid Trefftz-Finite Element Method for Open Domains
- Electrostatic-Structural Coupling Fundamentals Sequential
Method for Electrostatic-Structural Coupling
- Direct Matrix-Coupled Electrostatic-Structural Methods
using the TRANS126 Transducer
- Pre-Stressed Modal and Pre-Stressed Harmonic Analysis
using TRANS126
- Large-Signal Transient Analysis using TRANS126
- Reduced Order Macro Modeling for System Simulation
of MEMS Devices Introduction to Piezoelectric Analysis
- Introduction to Current Conduction Analysis Thermal-Electric
Coupled-Field Analysis
- Thermal Stress Analysis
- Using CFD for Reduced Order Modeling Damping Characterization
- Units System for MEMS Simulation
Each course chapter is followed by "hands-on"
workshops and exercises.
This course is currently scheduled on the following dates:
| Pittsburgh |
Philadelphia |
Research
Triangle Park |
Washington |
|
|
|
|
|
 |
10/8/2008 8:30 AM

10/10/2008 5:00 PM |
|
 |
4/15/2009 8:30 AM

4/17/2009 5:00 PM |
|
 |
10/21/2009 8:30 AM

10/23/2009 5:00 PM |
|
|