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ansys training

Multiphysics Simulation for MEMS
Duration: 3 Days
Cost: $1500
Course Topics Include:

  • Geometric Nonlinearities and Initial Stress Contact Analysis for MEMS Applications Pre-Stressed Modal Analysis Beam Cross-Section Modeling
  • Introduction to Electrostatic Analysis Capacitance
  • Hybrid Trefftz-Finite Element Method for Open Domains
  • Electrostatic-Structural Coupling Fundamentals Sequential Method for Electrostatic-Structural Coupling
  • Direct Matrix-Coupled Electrostatic-Structural Methods using the TRANS126 Transducer
  • Pre-Stressed Modal and Pre-Stressed Harmonic Analysis using TRANS126
  • Large-Signal Transient Analysis using TRANS126
  • Reduced Order Macro Modeling for System Simulation of MEMS Devices Introduction to Piezoelectric Analysis
  • Introduction to Current Conduction Analysis Thermal-Electric Coupled-Field Analysis
  • Thermal Stress Analysis
  • Using CFD for Reduced Order Modeling Damping Characterization
  • Units System for MEMS Simulation

Each course chapter is followed by "hands-on" workshops and exercises.


This course is currently scheduled on the following dates:

Pittsburgh Philadelphia Research Triangle Park Washington

Scheduled by Request

Scheduled by Request

Scheduled by Request

10/8/2008 8:30 AM

10/10/2008 5:00 PM

4/15/2009 8:30 AM

4/17/2009 5:00 PM

10/21/2009 8:30 AM

10/23/2009 5:00 PM




 

 
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